商品件数:8 1件~8件 (1ページ中 1ページめ)
High-Entropy Materials
著者:Huimin Xiang, Fu-Zhi Dai, Yanchun Zhou
出版社: Wiley
発売日: 2023年01月12日
High-Entropy Materials Significant update of knowledge in the field of high-entropy materials, including promising new high-entropy ceramics High-Entropy Materials provides information on state-of-t……続きを見る
価格:19,731円
Thermal Barrier Coatings: Failure Theory and Evaluation Technology
著者:Yichun Zhou, Li Yang, Wang Zhu
出版社: Springer Nature Singapore
発売日: 2022年11月11日
This book highlights the failure theories and evaluation techniques of thermal barrier coatings, covering the thermal-mechanical–chemical coupling theories, performance and damage characterization t……続きを見る
価格:13,369円
Advances in Transitional Flow Modeling
著者:Chunhua Sheng
出版社: Springer International Publishing
発売日: 2016年12月27日
This book provides a comprehensive description of numerical methods and validation processes for predicting transitional flows based on the Langtry–Menter local correlation-based transition model, i……続きを見る
価格:6,076円
Advanced Solid Mechanics
著者:Farzad Hejazi, Tan Kar Chun
出版社: CRC Press
発売日: 2021年05月10日
The main aim of this book is to demonstrate the fundamental theory of advanced solid mechanics through simplified derivations with details illustrations to deliver the principal concepts. It covers ……続きを見る
価格:19,348円
Conceptual Theories in Structural Dynamics
著者:Farzad Hejazi, Tan Kar Chun
出版社: Springer Nature Singapore
発売日: 2020年07月01日
This book discusses the conceptual theory of structural dynamics, using simplified methods and clear, concise explanations. It illustrates all the hypotheses in a simple and effective way and descri……続きを見る
価格:6,076円
Strategies of Sustainable Development in China’s Wind Power Industry
著者:Jiachun Li, Dexin He
出版社: Springer Nature Singapore
発売日: 2020年01月14日
This book reviews the status quo and visions for the future in the wind energy industry in China and around the globe, focusing on its roles in optimizing energy structure, alleviating environmental……続きを見る
価格:12,154円
The Evaporation Mechanism in the Wick of Copper Heat Pipes
著者:Shwin-Chung Wong
出版社: Springer International Publishing
発売日: 2015年12月29日
This book discusses the evaporation mechanism in the wick of copper heat pipes. The investigations are based on recent visualization experiments for operating horizontal flat-plate heat pipes. 続きを見る
価格:6,076円
Wafer-Level Chip-Scale Packaging
著者:Shichun Qu, Yong Liu
出版社: Springer New York
発売日: 2015年09月26日
Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances……続きを見る
価格:19,447円

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